SMT BGA Voids Formation and Prevention-1

19-12-2018

BGA voids cause current-intensive effects and reduce the mechanical strength of the solder joint during pcb assembly. 

Therefore, from the perspective of reliability, the cavity should be reduced. 

So how can you reduce BGA voids?

There are many reasons for the formation of BGA voids, such as the crystal structure of the solder joint alloy, the design of the PCB, the deposition amount of the solder paste, the reflow soldering process used, and the voids in the soldering process. 

Then we will explain the formation and prevention of BGA solder joint voids from the layer of solder paste to reduce the number of BGA solder joint void formation. 

Вземете най-новата цена? Ще отговорим възможно най-бързо (в рамките на 12 часа)

Политика за поверителност