Pcba processing quality agreement
Pcba processing quality agreement
1, PCB circuit board manufacturing
After receiving the order from PCBA, analyze the Gerber file, pay attention to the relationship between the hole pitch of the PCB and the bearing capacity of the board, and do not cause bending or breakage. Whether the wiring takes into account the key factors such as high-frequency signal interference and impedance.
2, component procurement and inspection
Procurement of components requires strict control of channels, and must be picked up from large traders and original factories, 100% to avoid second-hand materials and fake materials. In addition, set up a special incoming inspection position, strictly check the following items to ensure that the components are not faulty.
Solder paste printing and reflow soldering furnace temperature control are key points. It is very important to use laser steel mesh with good quality and meet process requirements. According to the requirements of the PCB, some need to increase or decrease the steel mesh, or use U-shaped holes to make steel mesh according to the process requirements. Reflow soldering furnace temperature and speed control is critical to solder paste infiltration and soldering reliability, and can be controlled in accordance with normal SOP operating guidelines. In addition, AOI testing needs to be strictly implemented to minimize the adverse effects caused by human factors.
In the plug-in process, the mold design for over-wave soldering is a key point. How to use the mold can maximize the probability of providing good quality after the furnace, which is a process that PE engineers must constantly practice and summarize.
In the previous DFM report, customers can be advised to set up some test points (TestPoints) on the PCB in order to test the PCB and the PCBA circuit continuity after soldering all components. If you have the conditions, you can ask the customer to provide a program to burn the program to the main control IC through the burner (such as ST-LINK, J-LINK, etc.), so that you can test the various touch actions more intuitively. Functional changes to verify the functional integrity of the entire PCBA.
For orders with PCBA test requirements, the main test contents include ICT (InCircuitTest), FCT (FunctionTest), BurnInTest (aging test), temperature and humidity test, drop test, etc., according to the customer's test plan operation and summary report data can.
Inspi tech will be your perfect PCB assembly supplier following the above processing agreement.